Flip-Up Stencils

Flip-Up Stencils are single-site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc. Great for QFNs where the pads on the board are larger than the pads on the component. All Flip Up stencils are made from stainless steel and are reusable after a quick wash in an alcohol-based cleaner. All Flip Up stencils are custom made to order per your specification.